TS80C32X2-LIA vs DS80C320-MCG+ feature comparison

TS80C32X2-LIA Temic Semiconductors

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DS80C320-MCG+ Maxim Integrated Products

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer TEMIC SEMICONDUCTORS MAXIM INTEGRATED PRODUCTS INC
Package Description PLASTIC, DIP-40 ROHS COMPLIANT, 0.600 INCH, PLASTIC, DIP-40
Reach Compliance Code unknown compliant
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
Clock Frequency-Max 30 MHz 25 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Speed 30 MHz 25 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 40
ECCN Code EAR99
HTS Code 8542.31.00.01
CPU Family 8051
JESD-609 Code e3
Length 52.075 mm
Moisture Sensitivity Level 1
Package Equivalence Code DIP40,.6
Peak Reflow Temperature (Cel) 260
RAM (bytes) 256
ROM Programmability MROM
Seated Height-Max 5.08 mm
Supply Current-Max 45 mA
Supply Voltage-Nom 5 V
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 15.24 mm

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