TS80C32X2-LIA
vs
SAB-C501G-LP
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
PLASTIC, DIP-40
|
|
Reach Compliance Code |
unknown
|
unknown
|
Has ADC |
NO
|
NO
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
30 MHz
|
12 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
|
Speed |
30 MHz
|
12 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.7 V
|
4.25 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
3
|
Part Package Code |
|
DIP
|
Pin Count |
|
40
|
|
|
|
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