TS80C32X2-MIBR vs TS80C52X2-MIBB feature comparison

TS80C32X2-MIBR Temic Semiconductors

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TS80C52X2-MIBB Atmel Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS ATMEL CORP
Package Description PLASTIC, LCC-44 QCCJ, LDCC44,.7SQ
Reach Compliance Code unknown compliant
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 S-PQCC-J44
JESD-609 Code e0 e0
Number of I/O Lines 32 32
Number of Terminals 40 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC44,.7SQ LDCC44,.7SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
Speed 40 MHz 40 MHz
Supply Current-Max 27 mA 27 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL QUAD
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Part Package Code LCC
Pin Count 44
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Boundary Scan NO
Length 16.5862 mm
Moisture Sensitivity Level 2
On Chip Program ROM Width 8
Peak Reflow Temperature (Cel) 225
ROM (words) 8192
ROM Programmability MROM
Seated Height-Max 4.57 mm
Width 16.5862 mm

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