TS80C32X2-MLC
vs
AT80C32X2-RLRUM
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP,
|
GREEN, VQFP-44
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G44
|
| Length |
10 mm
|
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM (words) |
0
|
0
|
| ROM Programmability |
ROM LESS
|
ROM LESS
|
| Seated Height-Max |
2.4 mm
|
|
| Speed |
40 MHz
|
40 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
10 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
1
|
| CPU Family |
|
8051
|
| JESD-609 Code |
|
e3
|
| Package Equivalence Code |
|
QFP44,.47SQ,32
|
| RAM (bytes) |
|
256
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare TS80C32X2-MLC with alternatives
Compare AT80C32X2-RLRUM with alternatives