TS80C52X2-ELBR
vs
TS87C52X2-LLCB
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
LCC
|
QFP
|
| Package Description |
QCCJ,
|
QFP,
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQFP-G44
|
| JESD-609 Code |
e3
|
e3
|
| Length |
16.6 mm
|
10 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
44
|
44
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM (words) |
8192
|
8192
|
| ROM Programmability |
MROM
|
OTPROM
|
| Seated Height-Max |
4.57 mm
|
2.4 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
16.6 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A991.A.2
|
| Clock Frequency-Max |
|
30 MHz
|
| Speed |
|
30 MHz
|
|
|
|
Compare TS80C52X2-ELBR with alternatives
Compare TS87C52X2-LLCB with alternatives