TS87C52X2-MCKB
vs
TS87C52X2-MCEB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
TEMIC SEMICONDUCTORS
|
| Package Description |
WINDOWED, CERAMIC, QPJ-44
|
VQFP-44
|
| Reach Compliance Code |
unknown
|
unknown
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
8051
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-CQCC-J44
|
S-PQFP-G44
|
| JESD-609 Code |
e0
|
e0
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
44
|
44
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QFP
|
| Package Equivalence Code |
LDCC44,.7SQ
|
QFP44,.47SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
256
|
256
|
| ROM (words) |
8192
|
8192
|
| ROM Programmability |
UVPROM
|
OTPROM
|
| Speed |
40 MHz
|
40 MHz
|
| Supply Current-Max |
55 mA
|
27 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
2
|
|
|
|