TS922AIN vs TLC277MJGB feature comparison

TS922AIN STMicroelectronics

Buy Now Datasheet

TLC277MJGB Rochester Electronics LLC

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS ROCHESTER ELECTRONICS LLC
Part Package Code DIP DIP
Package Description DIP, DIP8,.3 CERAMIC, DIP-8
Pin Count 8 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Samacsys Manufacturer STMicroelectronics
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.1 µA 0.00006 µA
Bias Current-Max (IIB) @25C 0.1 µA
Common-mode Reject Ratio-Nom 80 dB 80 dB
Frequency Compensation YES
Input Offset Voltage-Max 1800 µV 3750 µV
JESD-30 Code R-PDIP-T8 R-GDIP-T8
JESD-609 Code e3 e0
Low-Bias NO
Low-Offset NO
Micropower NO
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Power NO
Programmable Power NO
Qualification Status Not Qualified
Seated Height-Max 4.8 mm 5.08 mm
Slew Rate-Min 0.7 V/us
Slew Rate-Nom 1.3 V/us 2.9 V/us
Supply Current-Max 3 mA
Supply Voltage Limit-Max 14 V 18 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount NO NO
Technology BICMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 4000 1700
Voltage Gain-Min 15000
Wideband NO
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Length 9.58 mm
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare TS922AIN with alternatives

Compare TLC277MJGB with alternatives