TSB80C188EA20
vs
UPD70208HGK-20-9EU
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
NEC ELECTRONICS CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LFQFP,
|
TFQFP,
|
| Pin Count |
80
|
80
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS
|
IT CAN ALSO OPERATE AT 3V
|
| Address Bus Width |
20
|
20
|
| Bit Size |
16
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
40 MHz
|
20 MHz
|
| External Data Bus Width |
8
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQFP-G80
|
S-PQFP-G80
|
| Length |
12 mm
|
12 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
2
|
|
| Number of External Interrupts |
5
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
80
|
80
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
TFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
1.66 mm
|
1.2 mm
|
| Speed |
20 MHz
|
20 MHz
|
| Supply Current-Max |
90 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
MOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
12 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare TSB80C188EA20 with alternatives
Compare UPD70208HGK-20-9EU with alternatives