TSC80C31-12MG/883
vs
80C31BH/BQA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
12 MHz
|
12 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-GDIP-T40
|
R-GDIP-T40
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM (words) |
0
|
0
|
| ROM Programmability |
ROM LESS
|
ROM LESS
|
| Screening Level |
MIL-STD-883
|
|
| Speed |
12 MHz
|
12 MHz
|
| Supply Current-Max |
15.8 mA
|
20 mA
|
| Supply Voltage-Max |
5.5 V
|
6 V
|
| Supply Voltage-Min |
4.5 V
|
4 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
5
|
| Part Package Code |
|
DIP
|
| Package Description |
|
CERAMIC, DIP-40
|
| Pin Count |
|
40
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.31.00.01
|
| CPU Family |
|
8051
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| Length |
|
52.3875 mm
|
| Low Power Mode |
|
YES
|
| Package Equivalence Code |
|
DIP40,.6
|
| RAM (bytes) |
|
128
|
| Seated Height-Max |
|
5.588 mm
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
15.24 mm
|
|
|
|
Compare TSC80C31-12MG/883 with alternatives
Compare 80C31BH/BQA with alternatives