TSC80C31-40CD vs W77E58-40 feature comparison

TSC80C31-40CD Temic Semiconductors

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W77E58-40 Winbond Electronics Corp

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS WINBOND ELECTRONICS CORP
Reach Compliance Code unknown unknown
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO
CPU Family 8051 8051
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G44 R-PDIP-T40
JESD-609 Code e0 e0
Number of I/O Lines 32 32
Number of Terminals 44 40
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP DIP
Package Equivalence Code QFP44,.5SQ,32 DIP40,.6
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 128 1024
ROM (words) 0 32768
ROM Programmability ROM LESS FLASH
Speed 40 MHz 40 MHz
Supply Current-Max 41 mA 50 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position QUAD DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 1
Part Package Code DIP
Package Description DIP-40
Pin Count 40
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer Winbond
Length 52.2 mm
On Chip Program ROM Width 8
Seated Height-Max 5.334 mm
Width 15.24 mm

Compare TSC80C31-40CD with alternatives

Compare W77E58-40 with alternatives