TSC87C52-25IJ
vs
TSC87C52-25CJD
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TELEFUNKEN MICROELECTRONICS GMBH
|
TEMIC SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
|
| JESD-30 Code |
R-XDIP-T40
|
R-GDIP-T40
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP40,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
256
|
|
| ROM (words) |
8192
|
|
| ROM Programmability |
UVPROM
|
UVPROM
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Current-Max |
36.25 mA
|
36.25 mA
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
2
|
| Package Description |
|
CERAMIC, DIP-40
|
| Has ADC |
|
NO
|
| Address Bus Width |
|
16
|
| Clock Frequency-Max |
|
25 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
8
|
| Number of I/O Lines |
|
32
|
| PWM Channels |
|
NO
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER
|
|
|
|