TSR16UF61R9V vs MCR01ZZPF61R9 feature comparison

TSR16UF61R9V Tateyama Kagaku Group

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MCR01ZZPF61R9 ROHM Semiconductor

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Part Life Cycle Code Active Active
Ihs Manufacturer TATEYAMA KAGAKU GROUP ROHM CO LTD
Package Description CHIP CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature AEC-Q200
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.35 mm 0.35 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method TAPE TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.1 W 0.063 W
Rated Temperature 70 °C 70 °C
Resistance 61.9 Ω 61.9 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 50 V 50 V
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e3
Manufacturer Series MCR01
Package Shape RECTANGULAR PACKAGE
Series MCR01ZZP (F TOL)
Terminal Finish Tin (Sn)

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