TSS933DC vs MT8977AE feature comparison

TSS933DC Atmel Corporation

Buy Now Datasheet

MT8977AE Microsemi Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ATMEL CORP MITEL SEMICONDUCTOR
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP28,.6
Pin Count 28 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G28 R-PDIP-T28
Length 17.9 mm
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology BICMOS CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.5 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP28,.6
Supply Current-Max 10 mA
Terminal Finish Tin/Lead (Sn/Pb)

Compare TSS933DC with alternatives

Compare MT8977AE with alternatives