TTSI1K16T
vs
T-7630
feature comparison
| Part Life Cycle Code |
Active
|
|
| Ihs Manufacturer |
BROADCOM LTD
|
|
| Package Description |
LFQFP,
|
|
| Reach Compliance Code |
compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PQFP-G144
|
|
| JESD-609 Code |
e0
|
|
| Length |
20 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
144
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFQFP
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Telecom IC Type |
TIME SLOT ASSIGNER
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
20 mm
|
|
| Base Number Matches |
3
|
|
|
|
|
Compare TTSI1K16T with alternatives