TUSB8044ARGCT
vs
VL817-Q7(B0)
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
VIA LABS INC
|
| Package Description |
HVQCCN,
|
QFN-76
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Date Of Intro |
2019-02-21
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Additional Feature |
3.3V SUPPLY ALSO AVAILABLE, 34 MHZ NOMINAL CRYSTAL AVAILABLE
|
|
| Address Bus Width |
|
|
| Bus Compatibility |
I2C
|
SPI
|
| Data Transfer Rate-Max |
625 MBps
|
625 MBps
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N64
|
S-XQCC-N76
|
| JESD-609 Code |
e4
|
|
| Length |
9 mm
|
9 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
64
|
76
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1 mm
|
0.9 mm
|
| Supply Voltage-Max |
1.26 V
|
1.2 V
|
| Supply Voltage-Min |
0.99 V
|
1 V
|
| Supply Voltage-Nom |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
9 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
1
|
| Clock Frequency-Max |
|
25 MHz
|
| Package Equivalence Code |
|
LCC76,.35SQ,16
|
|
|
|
Compare TUSB8044ARGCT with alternatives
Compare VL817-Q7(B0) with alternatives