TVP5154PNP
vs
TVP5154PNPG4
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
HTQFP-128
|
HTFQFP, TQFP128,.63SQ,16
|
Pin Count |
128
|
128
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Additional Feature |
IT ALSO REQUIRES 3V TO 3.6V SUPPLY
|
IT ALSO REQUIRES 3V TO 3.6V SUPPLY
|
Consumer IC Type |
COLOR SIGNAL DECODER
|
COLOR SIGNAL DECODER
|
Input Type |
R-Y; B-Y; Y
|
|
JESD-30 Code |
S-PQFP-G128
|
S-PQFP-G128
|
JESD-609 Code |
e4
|
|
Length |
14 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
128
|
128
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTFQFP
|
HTFQFP
|
Package Equivalence Code |
TQFP128,.63SQ,16
|
TQFP128,.63SQ,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Current-Max |
174 mA
|
174 mA
|
Supply Voltage-Max (Vsup) |
1.95 V
|
1.95 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Video Standard |
PAL; NTSC; SECAM
|
PAL; NTSC; SECAM
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
4
|
1
|
|
|
|