TZM5253B-GS18
vs
1N5253A
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
MELF-2
|
HERMETIC SEALED, GLASS, DO-35, 2 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
10 Weeks
|
14 Weeks
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
35 Ω
|
35 Ω
|
| JEDEC-95 Code |
DO-213AA
|
DO-204AH
|
| JESD-30 Code |
O-LELF-R2
|
O-LALF-W2
|
| JESD-609 Code |
e2
|
e0
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
200 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.48 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
AEC-Q101
|
|
| Reference Voltage-Nom |
25 V
|
25 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN SILVER
|
TIN LEAD
|
| Terminal Form |
WRAP AROUND
|
WIRE
|
| Terminal Position |
END
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Voltage Tol-Max |
5%
|
10%
|
| Working Test Current |
5 mA
|
5 mA
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
Microchip
|
|
|
|
Compare TZM5253B-GS18 with alternatives
Compare 1N5253A with alternatives