U635H16BDC25 vs U635H16BD1K25 feature comparison

U635H16BDC25 Simtek Corporation

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U635H16BD1K25 Cypress Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIMTEK CORP SIMTEK CORP
Package Description 0.600 INCH, PLASTIC, DIP-24 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code R-PDIP-T24 R-PDIP-T28
JESD-609 Code e0 e0
Length 31.95 mm 37.1 mm
Memory Density 16384 bit 16384 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 28
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2KX8 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.1 mm
Standby Current-Max 0.003 A
Supply Current-Max 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 3 3
Pbfree Code No
Part Package Code DIP
Pin Count 28
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare U635H16BD1K25 with alternatives