U635H16BDC35 vs U635H16BDK35G1 feature comparison

U635H16BDC35 Simtek Corporation

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U635H16BDK35G1 Cypress Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIMTEK CORP SIMTEK CORP
Package Description DIP, DIP24,.6 DIP, DIP24,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
JESD-30 Code R-PDIP-T24 R-PDIP-T24
JESD-609 Code e0 e3
Length 31.95 mm 31.95 mm
Memory Density 16384 bit 16384 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2KX8 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.1 mm
Standby Current-Max 0.003 A 0.003 A
Supply Current-Max 0.08 mA 0.085 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 3 3
Pbfree Code Yes
Part Package Code DIP
Pin Count 24

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Compare U635H16BDK35G1 with alternatives