U635H256D1K35 vs U635H256D1C35G1 feature comparison

U635H256D1K35 Cypress Semiconductor

Buy Now Datasheet

U635H256D1C35G1 Cypress Semiconductor

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIMTEK CORP SIMTEK CORP
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 DIP, DIP28,.6
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
Alternate Memory Width 1 1
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e3
Length 37.1 mm 37.1 mm
Memory Density 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.1 mm
Standby Current-Max 0.038 A 0.003 A
Supply Current-Max 0.08 mA 0.075 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 3 3

Compare U635H256D1K35 with alternatives

Compare U635H256D1C35G1 with alternatives