U63764DK70 vs DS1225AB-70 feature comparison

U63764DK70 ZMDI

Buy Now Datasheet

DS1225AB-70 Dallas Semiconductor

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG DALLAS SEMICONDUCTOR
Part Package Code DIP
Package Description DIP, DIP28,.6 0.720 INCH, EXTENDED, DIP-28
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 70 ns 70 ns
Additional Feature 10 YEARS OF DATA RETENTION
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Length 37.1 mm
Memory Density 65536 bit 65536 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM MODULE
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm
Standby Current-Max 0.003 A 0.005 A
Supply Current-Max 0.065 mA 0.075 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 3 2

Compare U63764DK70 with alternatives

Compare DS1225AB-70 with alternatives