UBA1706TS
vs
BU8241FS-T2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROHM CO LTD
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
SSOP, SSOP24,.3
|
SSOP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| JESD-609 Code |
e4
|
e3/e2
|
| Length |
8.2 mm
|
10 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
75 °C
|
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Equivalence Code |
SSOP24,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
2.01 mm
|
| Supply Current-Max |
0.0032 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
SUPPORT CIRCUIT
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN/TIN COPPER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
5.4 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare UBA1706TS with alternatives
Compare BU8241FS-T2 with alternatives