UBA1706TS vs MC13156DWR2 feature comparison

UBA1706TS NXP Semiconductors

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MC13156DWR2

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Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SSOP
Package Description SSOP, SSOP24,.3
Pin Count 24
Reach Compliance Code compliant
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G24
JESD-609 Code e4
Length 8.2 mm
Number of Functions 1
Number of Terminals 24
Operating Temperature-Max 75 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code SSOP
Package Equivalence Code SSOP24,.3
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified
Seated Height-Max 2 mm
Supply Current-Max 0.0032 mA
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology BICMOS
Telecom IC Type CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Width 5.3 mm
Base Number Matches 1

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