UCD3138064ARGCR
vs
71M6511H-IGTR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
SILERGY CORP
|
| Package Description |
VQFN-64
|
LFQFP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
S-PQCC-N64
|
S-PQFP-G64
|
| JESD-609 Code |
e4
|
|
| Length |
9 mm
|
10 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
8
|
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1 mm
|
1.6 mm
|
| Supply Current-Max (Isup) |
105 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
9 mm
|
10 mm
|
| Base Number Matches |
1
|
2
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare UCD3138064ARGCR with alternatives
Compare 71M6511H-IGTR with alternatives