UCN5801A
vs
UCN5801LW
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALLEGRO MICROSYSTEMS LLC
|
ALLEGRO MICROSYSTEMS LLC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
0.400 INCH, DIP-22
|
SOIC-24
|
| Pin Count |
22
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Allegro Microsystems
|
|
| Built-in Protections |
TRANSIENT
|
TRANSIENT
|
| Driver Number of Bits |
8
|
8
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
LATCH BASED PERIPHERAL DRIVER
|
LATCH BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDIP-T22
|
R-PDSO-G24
|
| JESD-609 Code |
e3
|
e0
|
| Length |
27.555 mm
|
15.4 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
22
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Output Characteristics |
OPEN-COLLECTOR
|
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Output Current-Max |
0.35 A
|
0.35 A
|
| Output Peak Current Limit-Nom |
0.5 A
|
0.5 A
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP22,.4
|
SOP24,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.33 mm
|
2.65 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIMOS
|
BIMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
7.5 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare UCN5801A with alternatives
Compare UCN5801LW with alternatives