ULN2803LW
vs
TD62083APA
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ALLEGRO MICROSYSTEMS LLC
|
TOSHIBA CORP
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
SOIC-18
|
IN-LINE, R-PDIP-T18
|
Pin Count |
18
|
18
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Samacsys Manufacturer |
Allegro Microsystems
|
|
Additional Feature |
LOGIC LEVEL COMPATIBLE
|
LOGIC LEVEL COMPATIBLE
|
Collector Current-Max (IC) |
0.5 A
|
0.5 A
|
Collector-Emitter Voltage-Max |
50 V
|
50 V
|
Configuration |
8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
|
8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
|
JEDEC-95 Code |
MS-013AB
|
|
JESD-30 Code |
R-PDSO-G18
|
R-PDIP-T18
|
JESD-609 Code |
e0
|
|
Number of Elements |
8
|
8
|
Number of Terminals |
18
|
18
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-20 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
240
|
NOT SPECIFIED
|
Polarity/Channel Type |
NPN
|
NPN
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
VCEsat-Max |
1.6 V
|
1.6 V
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
DC Current Gain-Min (hFE) |
|
1000
|
|
|
|
Compare ULN2803LW with alternatives
Compare TD62083APA with alternatives