UPC4574G2
vs
UPC4574G2-A
feature comparison
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Life Cycle Code |
|
Active
|
Ihs Manufacturer |
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
|
SOP
|
Package Description |
|
SOP, SOP14,.25
|
Pin Count |
|
14
|
Manufacturer Package Code |
|
PRSP0014DI-A14
|
Reach Compliance Code |
|
compliant
|
ECCN Code |
|
5A002
|
HTS Code |
|
8542.33.00.01
|
Samacsys Manufacturer |
|
Renesas Electronics
|
Amplifier Type |
|
OPERATIONAL AMPLIFIER
|
Architecture |
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
|
1 µA
|
Bias Current-Max (IIB) @25C |
|
1 µA
|
Common-mode Reject Ratio-Nom |
|
100 dB
|
Frequency Compensation |
|
YES
|
Input Offset Voltage-Max |
|
5000 µV
|
JESD-30 Code |
|
R-PDSO-G14
|
JESD-609 Code |
|
e6
|
Length |
|
10.2 mm
|
Low-Offset |
|
NO
|
Neg Supply Voltage Limit-Max |
|
-18 V
|
Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
Number of Functions |
|
4
|
Number of Terminals |
|
14
|
Operating Temperature-Max |
|
80 °C
|
Operating Temperature-Min |
|
-20 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
SOP
|
Package Equivalence Code |
|
SOP14,.25
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Packing Method |
|
TR, EMBOSSED
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.8 mm
|
Slew Rate-Min |
|
4 V/us
|
Slew Rate-Nom |
|
6 V/us
|
Supply Current-Max |
|
12 mA
|
Supply Voltage Limit-Max |
|
18 V
|
Supply Voltage-Nom (Vsup) |
|
15 V
|
Surface Mount |
|
YES
|
Technology |
|
BIPOLAR
|
Temperature Grade |
|
COMMERCIAL EXTENDED
|
Terminal Finish |
|
TIN BISMUTH
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
10
|
Unity Gain BW-Nom |
|
7000
|
Voltage Gain-Min |
|
30000
|
Width |
|
4.4 mm
|
Base Number Matches |
|
1
|
|
|
|