UPD17225MC-XXX-5A4
vs
UPD17225MC-XXX-5A4
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NEC ELECTRONICS CORP
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
LSSOP, SSOP30,.3
|
0.300 INCH, PLASTIC, SSOP-30
|
| Pin Count |
30
|
30
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
4
|
4
|
| CPU Family |
UPD17K
|
|
| Clock Frequency-Max |
8 MHz
|
8 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G30
|
R-PDSO-G30
|
| Length |
9.85 mm
|
9.85 mm
|
| Number of I/O Lines |
20
|
20
|
| Number of Terminals |
30
|
30
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
LSSOP
|
| Package Equivalence Code |
SSOP30,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM (words) |
2048
|
|
| ROM Programmability |
MROM
|
MROM
|
| Seated Height-Max |
1.4 mm
|
1.4 mm
|
| Speed |
0.25 MHz
|
|
| Supply Current-Max |
1.8 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
MOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.1 mm
|
6.1 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare UPD17225MC-XXX-5A4 with alternatives
Compare UPD17225MC-XXX-5A4 with alternatives