UPD30500AS2-250
vs
IDT79RV5000267BS
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NEC ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA,
|
SBGA-272
|
Pin Count |
272
|
272
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY FOR I/O
|
|
Address Bus Width |
64
|
64
|
Bit Size |
64
|
64
|
Boundary Scan |
NO
|
YES
|
Clock Frequency-Max |
100 MHz
|
267 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
NO
|
JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
JESD-609 Code |
e1
|
e0
|
Length |
29 mm
|
29 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
272
|
272
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.65 mm
|
Speed |
250 MHz
|
267 MHz
|
Supply Voltage-Max |
2.625 V
|
3.465 V
|
Supply Voltage-Min |
2.375 V
|
3.135 V
|
Supply Voltage-Nom |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
MOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
10
|
|
Width |
29 mm
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Package Equivalence Code |
|
BGA272,21X21,50
|
|
|
|
Compare UPD30500AS2-250 with alternatives
Compare IDT79RV5000267BS with alternatives