UPD30500AS2-250 vs MPC5200CBV266B feature comparison

UPD30500AS2-250 NEC Electronics Group

Buy Now Datasheet

MPC5200CBV266B Freescale Semiconductor

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEC ELECTRONICS CORP FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LBGA, BGA, BGA272,20X20,50
Pin Count 272 272
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY FOR I/O ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 64 32
Bit Size 64 32
Boundary Scan NO YES
Clock Frequency-Max 100 MHz 35 MHz
External Data Bus Width 64 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B272 S-PBGA-B272
JESD-609 Code e1 e0
Length 29 mm 27 mm
Low Power Mode YES YES
Number of Terminals 272 272
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 2.65 mm
Speed 250 MHz 266 MHz
Supply Voltage-Max 2.625 V 1.58 V
Supply Voltage-Min 2.375 V 1.42 V
Supply Voltage-Nom 2.5 V 1.5 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 10
Width 29 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Package Equivalence Code BGA272,20X20,50

Compare UPD30500AS2-250 with alternatives

Compare MPC5200CBV266B with alternatives