UPD30500S2-200 vs IDT79RV5000267BS feature comparison

UPD30500S2-200 NEC Electronics Group

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IDT79RV5000267BS Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEC ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LBGA, SBGA-272
Pin Count 272 272
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature 5 PIPELINE STAGE
Address Bus Width 64 64
Bit Size 64 64
Boundary Scan NO YES
Clock Frequency-Max 100 MHz 267 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES NO
JESD-30 Code S-PBGA-B272 S-PBGA-B272
JESD-609 Code e1 e0
Length 29 mm 29 mm
Low Power Mode YES YES
Number of Terminals 272 272
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.65 mm
Speed 200 MHz 267 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 10
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Package Equivalence Code BGA272,21X21,50

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Compare IDT79RV5000267BS with alternatives