UPD30500S2-200
vs
STP1100BGA-100
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEC ELECTRONICS AMERICA INC
|
SUN MICROSYSTEMS INC
|
| Package Description |
29 X 29 MM, PLASTIC, BGA-272
|
BGA, BGA272,20X20,50
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
64
|
32
|
| Bit Size |
64
|
32
|
| Boundary Scan |
NO
|
YES
|
| Clock Frequency-Max |
100 MHz
|
33.33 MHz
|
| External Data Bus Width |
64
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
272
|
272
|
| Operating Temperature-Max |
85 °C
|
80 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
200 MHz
|
100 MHz
|
| Supply Voltage-Max |
3.465 V
|
3.47 V
|
| Supply Voltage-Min |
3.135 V
|
3.14 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
272
|
| Length |
|
27 mm
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
|
15
|
| Number of Serial I/Os |
|
|
| On Chip Data RAM Width |
|
|
| Package Equivalence Code |
|
BGA272,20X20,50
|
| RAM (words) |
|
0
|
| Seated Height-Max |
|
2.54 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
27 mm
|
|
|
|
Compare UPD30500S2-200 with alternatives
Compare STP1100BGA-100 with alternatives