UPD30500S2-200
vs
UPD30500BS2-300
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEC ELECTRONICS CORP
|
NEC ELECTRONICS CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA,
|
LBGA,
|
| Pin Count |
272
|
272
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
5 PIPELINE STAGE
|
ALSO REQUIRES 3.3V SUPPLY FOR I/O
|
| Address Bus Width |
64
|
64
|
| Bit Size |
64
|
64
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
100 MHz
|
100 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
| JESD-609 Code |
e1
|
e0
|
| Length |
29 mm
|
29 mm
|
| Low Power Mode |
YES
|
NO
|
| Number of Terminals |
272
|
272
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Speed |
200 MHz
|
300 MHz
|
| Supply Voltage-Max |
3.465 V
|
1.9 V
|
| Supply Voltage-Min |
3.135 V
|
1.7 V
|
| Supply Voltage-Nom |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
MOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Width |
29 mm
|
29 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
|
|
|
Compare UPD30500S2-200 with alternatives
Compare UPD30500BS2-300 with alternatives