UPD30550AF2-400-NN1
vs
UPD30500AS2-266
feature comparison
Part Life Cycle Code |
|
Obsolete
|
Ihs Manufacturer |
|
NEC ELECTRONICS CORP
|
Part Package Code |
|
BGA
|
Package Description |
|
LBGA,
|
Pin Count |
|
272
|
Reach Compliance Code |
|
unknown
|
ECCN Code |
|
3A991.A.2
|
HTS Code |
|
8542.31.00.01
|
Address Bus Width |
|
64
|
Bit Size |
|
64
|
Boundary Scan |
|
NO
|
Clock Frequency-Max |
|
100 MHz
|
External Data Bus Width |
|
64
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
YES
|
JESD-30 Code |
|
S-PBGA-B272
|
JESD-609 Code |
|
e1
|
Length |
|
29 mm
|
Low Power Mode |
|
YES
|
Number of Terminals |
|
272
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LBGA
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.7 mm
|
Speed |
|
266 MHz
|
Supply Voltage-Max |
|
2.7 V
|
Supply Voltage-Min |
|
2.5 V
|
Supply Voltage-Nom |
|
2.6 V
|
Surface Mount |
|
YES
|
Technology |
|
MOS
|
Temperature Grade |
|
OTHER
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
10
|
Width |
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
Base Number Matches |
|
1
|
|
|
|
Compare UPD30500AS2-266 with alternatives