UPD30550AF2-400-NN1
vs
STP1100BGA-100
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NEC ELECTRONICS CORP
|
SUN MICROSYSTEMS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
BGA, BGA272,20X20,50
|
Pin Count |
272
|
272
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
64
|
32
|
Bit Size |
64
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
33.33 MHz
|
External Data Bus Width |
64
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
JESD-609 Code |
e1
|
|
Length |
29 mm
|
27 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
272
|
272
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.05 mm
|
2.54 mm
|
Speed |
400 MHz
|
100 MHz
|
Supply Voltage-Max |
1.7 V
|
3.47 V
|
Supply Voltage-Min |
1.6 V
|
3.14 V
|
Surface Mount |
YES
|
YES
|
Technology |
MOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
10
|
|
Width |
29 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Number of DMA Channels |
|
|
Number of External Interrupts |
|
15
|
Number of Serial I/Os |
|
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
|
80 °C
|
Operating Temperature-Min |
|
|
Package Equivalence Code |
|
BGA272,20X20,50
|
RAM (words) |
|
0
|
Supply Voltage-Nom |
|
3.3 V
|
Temperature Grade |
|
COMMERCIAL EXTENDED
|
|
|
|
Compare UPD30550AF2-400-NN1 with alternatives
Compare STP1100BGA-100 with alternatives