UPD350A-I/Q8XVAA
vs
VNC2-32Q1B
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
| Package Description |
QFN-28
|
HVQCCN, LCC32,.27SQ,25
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bus Compatibility |
I2C
|
|
| JESD-30 Code |
S-PQCC-N28
|
S-XQCC-N32
|
| Length |
4 mm
|
7 mm
|
| Number of Terminals |
28
|
32
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC28,.16SQ,16
|
LCC32,.27SQ,25
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
0.9 mm
|
1 mm
|
| Supply Current-Max |
15 mA
|
|
| Supply Voltage-Max |
1.98 V
|
1.98 V
|
| Supply Voltage-Min |
1.62 V
|
1.62 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
4 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
32
|
| Samacsys Manufacturer |
|
FTDI Chip
|
| Additional Feature |
|
ALSO REQUIRES AT 3.3 V I/O SUPPLY
|
| Address Bus Width |
|
|
| Clock Frequency-Max |
|
6 MHz
|
| Data Transfer Rate-Max |
|
1.5 MBps
|
| External Data Bus Width |
|
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare UPD350A-I/Q8XVAA with alternatives
Compare VNC2-32Q1B with alternatives