UPD350DT/Q8X
vs
VNC2-32L1C
feature comparison
Part Life Cycle Code |
End Of Life
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
Package Description |
QFN-28
|
LQFP-32
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Microchip
|
FTDI Chip
|
Bus Compatibility |
I2C; SPI; USB
|
SPI; UART; USB
|
Clock Frequency-Max |
48 MHz
|
12 MHz
|
JESD-30 Code |
S-PQCC-N28
|
S-PQFP-G32
|
Length |
4 mm
|
7 mm
|
Number of Terminals |
28
|
32
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HQCCN
|
LQFP
|
Package Equivalence Code |
LCC28,.16SQ,16
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
FLATPACK, LOW PROFILE
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
0.9 mm
|
1.6 mm
|
Supply Current-Max |
15 mA
|
|
Supply Voltage-Max |
1.98 V
|
1.98 V
|
Supply Voltage-Min |
1.62 V
|
1.62 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
4 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Address Bus Width |
|
|
Data Transfer Rate-Max |
|
1.5 MBps
|
Drive Interface Standard |
|
RS232; RS422; RS485
|
External Data Bus Width |
|
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare UPD350DT/Q8X with alternatives
Compare VNC2-32L1C with alternatives