UPD431000AGZ-70LL-KJH
vs
K6X1008C2D-TF700
feature comparison
| Rohs Code |
|
No
|
| Part Life Cycle Code |
|
Obsolete
|
| Ihs Manufacturer |
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
|
TSOP1
|
| Package Description |
|
TSOP1, TSSOP32,.8,20
|
| Pin Count |
|
32
|
| Reach Compliance Code |
|
unknown
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.41
|
| Access Time-Max |
|
70 ns
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-PDSO-G32
|
| Length |
|
18.4 mm
|
| Memory Density |
|
1048576 bit
|
| Memory IC Type |
|
STANDARD SRAM
|
| Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
32
|
| Number of Words |
|
131072 words
|
| Number of Words Code |
|
128000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
128KX8
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSOP1
|
| Package Equivalence Code |
|
TSSOP32,.8,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Standby Current-Max |
|
0.00001 A
|
| Standby Voltage-Min |
|
2 V
|
| Supply Current-Max |
|
0.025 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
8 mm
|
| Base Number Matches |
|
1
|
|
|
|
Compare K6X1008C2D-TF700 with alternatives