UPD43256BGW-70LL-9JL-A
vs
CY62256LL-70ZXI
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Obsolete
|
| Ihs Manufacturer |
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
|
TSOP
|
| Package Description |
|
8 X 13.40 MM, LEAD FREE, TSOP1-28
|
| Pin Count |
|
28
|
| Reach Compliance Code |
|
unknown
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.41
|
| Access Time-Max |
|
70 ns
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-PDSO-G28
|
| JESD-609 Code |
|
e4
|
| Length |
|
11.8 mm
|
| Memory Density |
|
262144 bit
|
| Memory IC Type |
|
STANDARD SRAM
|
| Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
28
|
| Number of Words |
|
32768 words
|
| Number of Words Code |
|
32000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
32KX8
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSOP1
|
| Package Equivalence Code |
|
TSSOP28,.53,22
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Standby Voltage-Min |
|
2 V
|
| Supply Current-Max |
|
0.05 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.55 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
| Width |
|
8 mm
|
| Base Number Matches |
|
2
|
|
|
|
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