UPD44164364F5-E30-EQ1
vs
71V3576YS150BGGI
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NEC ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
BGA,
|
Pin Count |
165
|
119
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
0.27 ns
|
3.8 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B119
|
JESD-609 Code |
e0
|
e1
|
Length |
15 mm
|
22 mm
|
Memory Density |
18874368 bit
|
4718592 bit
|
Memory IC Type |
DDR SRAM
|
CACHE SRAM
|
Memory Width |
36
|
36
|
Number of Functions |
1
|
1
|
Number of Terminals |
165
|
119
|
Number of Words |
524288 words
|
131072 words
|
Number of Words Code |
512000
|
128000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Organization |
512KX36
|
128KX36
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
1.9 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
13 mm
|
14 mm
|
Base Number Matches |
1
|
2
|
Moisture Sensitivity Level |
|
3
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Seated Height-Max |
|
2.36 mm
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare UPD44164364F5-E30-EQ1 with alternatives
Compare 71V3576YS150BGGI with alternatives