UPD44164364F5-E30-EQ1 vs IS61QDPB21M18A-300B4 feature comparison

UPD44164364F5-E30-EQ1 Renesas Electronics Corporation

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IS61QDPB21M18A-300B4 Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED SILICON SOLUTION INC
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.27 ns 0.45 ns
Clock Frequency-Max (fCLK) 333 MHz 300 MHz
I/O Type COMMON SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Memory Density 18874368 bit 18874368 bit
Memory IC Type STANDARD SRAM QDR SRAM
Memory Width 36 18
Number of Terminals 165 165
Number of Words 524288 words 1048576 words
Number of Words Code 512000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 512KX36 1MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.265 A 0.28 A
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 0.52 mA 1.05 mA
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 1
Rohs Code No
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Additional Feature PIPELINED ARCHITECTURE
Length 15 mm
Number of Functions 1
Operating Temperature-Max 70 °C
Operating Temperature-Min
Seated Height-Max 1.4 mm
Supply Voltage-Max (Vsup) 1.89 V
Supply Voltage-Min (Vsup) 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V
Temperature Grade COMMERCIAL
Width 13 mm

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