UPD44325182F5-E50-EQ2 vs K7R321882M-FC20 feature comparison

UPD44325182F5-E50-EQ2 NEC Electronics Group

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K7R321882M-FC20 Samsung Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEC ELECTRONICS CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 15 X 17 MM, 1 MM PITCH, FBGA-165
Pin Count 165 165
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e0
Length 15 mm 17 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type QDR SRAM QDR SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX18 2MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 15 mm
Base Number Matches 2 2
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type SEPARATE
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Peak Reflow Temperature (Cel) 240
Seated Height-Max 1.4 mm
Standby Current-Max 0.3 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.76 mA

Compare UPD44325182F5-E50-EQ2 with alternatives

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