UPD444001LE-10-A
vs
K6R4004C1B-TC10
feature comparison
| Rohs Code |
|
No
|
| Part Life Cycle Code |
|
Obsolete
|
| Ihs Manufacturer |
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
|
TSOP2
|
| Package Description |
|
TSOP2, TSOP32,.46
|
| Pin Count |
|
32
|
| Reach Compliance Code |
|
unknown
|
| ECCN Code |
|
3A991.B.2.A
|
| HTS Code |
|
8542.32.00.41
|
| Access Time-Max |
|
10 ns
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-PDSO-G32
|
| JESD-609 Code |
|
e0
|
| Length |
|
20.95 mm
|
| Memory Density |
|
4194304 bit
|
| Memory IC Type |
|
STANDARD SRAM
|
| Memory Width |
|
4
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
32
|
| Number of Words |
|
1048576 words
|
| Number of Words Code |
|
1000000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
1MX4
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSOP2
|
| Package Equivalence Code |
|
TSOP32,.46
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Standby Current-Max |
|
0.01 A
|
| Standby Voltage-Min |
|
4.5 V
|
| Supply Current-Max |
|
0.195 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
10.16 mm
|
| Base Number Matches |
|
2
|
|
|
|
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