UPD444001LE-10-A
vs
K6R4004C1D-JI100
feature comparison
Rohs Code |
|
No
|
Part Life Cycle Code |
|
Obsolete
|
Ihs Manufacturer |
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
|
SOJ
|
Package Description |
|
SOJ,
|
Pin Count |
|
32
|
Reach Compliance Code |
|
compliant
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
Access Time-Max |
|
10 ns
|
JESD-30 Code |
|
R-PDSO-J32
|
Length |
|
20.95 mm
|
Memory Density |
|
4194304 bit
|
Memory IC Type |
|
STANDARD SRAM
|
Memory Width |
|
4
|
Number of Functions |
|
1
|
Number of Terminals |
|
32
|
Number of Words |
|
1048576 words
|
Number of Words Code |
|
1000000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
1MX4
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
SOJ
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Parallel/Serial |
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
|
240
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
3.76 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
J BEND
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
10.16 mm
|
Base Number Matches |
|
1
|
|
|
|
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