UPD44645092F5-E50-FQ1 vs GS8662Q09BGD-357T feature comparison

UPD44645092F5-E50-FQ1 NEC Electronics Group

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GS8662Q09BGD-357T GSI Technology

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NEC ELECTRONICS CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, LBGA, BGA165,11X15,40
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0
Length 17 mm 15 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type QDR SRAM QDR SRAM
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8MX9 8MX9
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.51 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 13 mm
Base Number Matches 2 1
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 357 MHz
I/O Type SEPARATE
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Voltage-Min 1.7 V
Supply Current-Max 0.985 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare GS8662Q09BGD-357T with alternatives