UPD705100GJ-100-8EU-A
vs
IDT79RC32V364133DAI
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NEC ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LFQFP,
|
20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
YES
|
| Clock Frequency-Max |
100 MHz
|
133 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| JESD-609 Code |
e6/e4
|
e0
|
| Length |
20 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
144
|
144
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3 mm
|
1.6 mm
|
| Speed |
100 MHz
|
133 MHz
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Terminal Finish |
TIN BISMUTH/NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
20
|
| Width |
20 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Moisture Sensitivity Level |
|
3
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Supply Voltage-Max |
|
3.465 V
|
| Supply Voltage-Min |
|
3.135 V
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare UPD705100GJ-100-8EU-A with alternatives
Compare IDT79RC32V364133DAI with alternatives