UPD78F0375GK-8EU-A
vs
UPD78F0373GK(T)-8EU-A
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NEC ELECTRONICS CORP
|
NEC ELECTRONICS AMERICA INC
|
| Part Package Code |
QFP
|
|
| Package Description |
LFQFP,
|
12 X 12 MM, FINE PITCH, PLASTIC, LQFP-80
|
| Pin Count |
80
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G80
|
S-PQFP-G80
|
| JESD-609 Code |
e6
|
e6/e4
|
| Length |
12 mm
|
12 mm
|
| Number of I/O Lines |
34
|
34
|
| Number of Terminals |
80
|
80
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Speed |
20 MHz
|
20 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
1.8 V
|
4 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN BISMUTH
|
TIN BISMUTH/NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
12 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
3
|
3
|
| Additional Feature |
|
ALSO OPERTAES AT 1.8V MINIMUM SUPPLY AT 5 MHZ
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Voltage-Nom |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare UPD78F0375GK-8EU-A with alternatives