USB5807CT/KD
vs
GL3523-OTYS1
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
GENESYS LOGIC INC
|
| Package Description |
VQFN-100
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
6 Weeks
|
|
| Date Of Intro |
2019-07-24
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
also available with 3.3v supply
|
25MHZ NOMINAL FREQUENCY AVAILABLE
|
| Bus Compatibility |
I2C; SMBUS; SPI; USB
|
I2C; SPI; SMBUS
|
| Clock Frequency-Max |
25 MHz
|
|
| Data Transfer Rate-Max |
625 MBps
|
60 MBps
|
| JESD-30 Code |
S-PQCC-N100
|
S-XQCC-N76
|
| Length |
12 mm
|
9 mm
|
| Number of Terminals |
100
|
76
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC100,.47SQ,16
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Voltage-Max |
1.32 V
|
1.32 V
|
| Supply Voltage-Min |
1.08 V
|
1.15 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
12 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
1
|
| Address Bus Width |
|
|
| External Data Bus Width |
|
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare USB5807CT/KD with alternatives
Compare GL3523-OTYS1 with alternatives