USB5816/KD
vs
USB5816-I/KD
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
VQFN-100
|
VQFN-100
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
52 Weeks
|
52 Weeks
|
| Date Of Intro |
2016-10-03
|
2016-10-03
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Address Bus Width |
|
|
| Bus Compatibility |
I2C; SMBUS; SPI; UART; USB
|
I2C; SMBUS; SPI; UART; USB
|
| Clock Frequency-Max |
25 MHz
|
25 MHz
|
| Data Transfer Rate-Max |
625 MBps
|
625 MBps
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N100
|
S-PQCC-N100
|
| JESD-609 Code |
e3
|
e3
|
| Length |
12 mm
|
12 mm
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC100,.47SQ,16
|
LCC100,.47SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Voltage-Max |
1.32 V
|
1.32 V
|
| Supply Voltage-Min |
1.08 V
|
1.08 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
12 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare USB5816/KD with alternatives
Compare USB5816-I/KD with alternatives