UVP1H2R2MDA1CV
vs
BPS1H2R2
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NICHICON CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
,
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.22.00
|
|
| Capacitance |
2.2 µF
|
2.2 µF
|
| Capacitor Type |
ALUMINUM ELECTROLYTIC CAPACITOR
|
ALUMINUM ELECTROLYTIC CAPACITOR
|
| Dielectric Material |
ALUMINUM (WET)
|
ALUMINUM (WET)
|
| JESD-609 Code |
e0
|
|
| Leakage Current |
0.0033 mA
|
0.005 mA
|
| Manufacturer Series |
VP
|
BP-S
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Shape |
CYLINDRICAL PACKAGE
|
CYLINDRICAL PACKAGE
|
| Packing Method |
BULK
|
|
| Polarity |
NON-POLARIZED
|
POLARIZED
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
50 V
|
50 V
|
| Ripple Current |
25 mA
|
148 mA
|
| Surface Mount |
NO
|
NO
|
| Tan Delta |
0.14
|
0.5@5KHz
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Shape |
WIRE
|
WIRE
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare UVP1H2R2MDA1CV with alternatives
Compare BPS1H2R2 with alternatives